Silicon photonics hold promise for commoditizing PICs, following the example of silicon microelectronics. The excitement of early demonstrations was followed by a period of consolidation where major technological hurdles were overcome, raising expectations for an imminent era of productivity and market ramp-up.
This workshop aims to highlight the latest achievements in silicon photonics, and elucidate on the requirements posed by prominent application fields. Experts on the various integration platforms as well as users of the technology are brought together, and attempt to answer burning questions, such as:
What needs to be done for silicon photonics to dominate short- and medium-reach communications?
How can silicon photonics match the economics of VCSEL links?
What level of electronic/photonic integration is needed to support the demands of next-generation datacenters?
What is the best flavor of III-V and silicon integration for very large-scale PICs with multiple functionalities and many ports?
What is the path for cost-effective best power efficiency, on-chip lasers, or off-chip optical power supplies?
Are III-V-on-silicon lasers ready for prime time?
Is it possible to meet the I/O requirements of multi-terabit switches in datacenters?
Can photonics be brought all the way to the chip to revolutionize the way microprocessors and computing subsystems are conceived and designed in the next decade?
Is there a path for realising chip-to-chip photonic interfaces in 2025?
What are the main challenges and opportunities of the adoption of optical links?
How does the cost of silicon photonics chips scale with volume?
What is the path to low-cost packaging of silicon photonics chips?
Is silicon photonics only affordable for high-volume products?
Are packaging costs strangling the uptake of silicon photonics?
As optics moves into chip-packages, how must the global supply chain evolve?
Lionel C. Kimerling, MIT, USA
“Merging Photonics with nano-electronics”
Jörg-Peter Elbers, ADVA, Germany
“Silicon Photonics for Exascale Data Networks”
Greg Fish, Juniper Networks, USA
“Heterogeneous Integration of III-V/Si Photonics for high optical speed transceivers”
Paraskevas Bakopoulos, NTUA, Greece
“VCSEL-enabled silicon photonics for short-reach optical interconnects”
Elad Mentovich, Mellanox Technologies, Israel
“Silicon photonics for 400 Gb/s short-reach optical interconnects”
Mehrad Ziari, Infinera, USA
“Multi-channel Tb/s-scale PICs for High-Capacity Interconnects”
Michael Hochberg, Elenion, USA
“Complexity and volume scaling in silicon photonics: How do we make optics look more like electronics?”
John Bowers, UC Santa Barbara, USA
“III-V on Si Lasers: Ready for Primetime”
Kevin Williams, TU/e, The Netherlands
“Integrating Silicon and monolithic InP photonics”
Peter De Dobbelaere, Luxtera, USA
“Real world trade-offs for high volume silicon photonics transceiver manufacturing”
Kazuhiko Kurata, PETRA, Japan
“Hybrid integration of LD chips on silicon photonics integrated circuits”
Richard Pitwon, Seagate Systems, UK
“Accelerating the commercial viability of silicon photonics in exascale data centere environments”
Sebastien Rumley, Columbia University, USA
“Can integrated optics meet the challenge of Multi-Terabyte/s off-chip bandwidths?”
Nikos Pleros, AUTH, Greece
“Chip-scale disaggregated computing via Silicon Photonics: can be more than replacing a link!”
Mitsuru Takenaka, University of Tokyo, Japan
“Electronic-photonic integrated circuits based on heterogeneous integration of Ge/III-V on Si”
José Luis Gonzalez, CEA, France
“Electronics and silicon photonics for optical networks on-chip and many cores modules”
Rajeev Ram, MIT, USA
“Toward high performance computing with electronic-photonic integration”
Igor Krestnikov, Innolume, Germany
“GaAs-based comb-laser for interconnect applications”
Chris Doerr, Acacia Communications, USA
“Short- to long-reach optical communications: where does silicon photonics fit in and does it make economic sense?”
Philippe Absil, IMEC, Belgium
“Is there still a need for R&D silicon photonics “foundries” in the eco-system?”
Norbert Keil, HHI, Germany
“Is Hybrid the new Monolithic? Why the photonic integration technologies should work together”
Peter O’Brien, Tyndall, Ireland
“What does it take to drive down the cost of silicon PIC packaging?”
Jessie Rosenberg, IBM USA
“High-throughput and scalable packaging: an enabler for silicon photonics?”
Abdul Rahim, Ghent University and ePIXfab, Belgium
“Standardisation and Diversification in Silicon Photonics Platforms: What do they bring?”